5330-01-019-2175

Find complete technical information, availability, and procurement data for: 5330-01-019-2175
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Federal Supply Group

Hardware and Abrasives

Federal Supply Classification

5330 Packing and Gasket Materials

National Stock Number

5330-01-019-2175

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes:semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.

5330-01-019-2175, no name available

FAQs

Find helpful answers about installation, operation, maintenance, compliance, and troubleshooting.

What is the FSCG of the NSN 5330-01-019-2175?

The FSCG of the NSN 5330-01-019-2175 is 5330

Does NSN 5330-01-019-2175 require demilitarization?

Items subject to the export administration regulations (ear) in parts 730-774 of title 15, code of federal regulations (cfr) (ccli or ear99) and determined by dod to present a low risk when released out of dod control. No demil, mut, or end use certificate is required. May require an export licensefrom doc.

Does NSN 5330-01-019-2175 contain precious materials?

Precious metal content is unknown

Does NSN 5330-01-019-2175 contain hazardous materials?

Indicates there is no information in the hmirs. The nsn is in a fsc in table ii of fed std 313 and a msds may be required by the user. The requirement for a msds is dependent on a hazard determination of the supplier or the intended end use of item.