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5330-00-888-9332

Find complete technical information, availability, and procurement data for: 5330-00-888-9332

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5330-00-888-9332
Federal Supply Group
Hardware and Abrasives
Federal Supply Classification
5330 Packing and Gasket Materials
National Stock Number
5330-00-888-9332

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes:devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes:network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

5330-00-888-9332, no name available

FAQs

Find helpful answers about installation, operation, maintenance, compliance, and troubleshooting.

What is the FSCG of the NSN 5330-00-888-9332?
The FSCG of the NSN 5330-00-888-9332 is 5330
Does NSN 5330-00-888-9332 require demilitarization?
Usml items - mutilation to the point of scrap required worldwide. (note 7).
Does NSN 5330-00-888-9332 contain precious materials?
Precious metal content is unknown
Does NSN 5330-00-888-9332 contain hazardous materials?
Indicates there is no information in the hmirs. The nsn is in a fsc in table ii of fed std 313 and a msds may be required by the user. The requirement for a msds is dependent on a hazard determination of the supplier or the intended end use of item.

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