5999-01-029-9111
Find complete technical information, availability, and procurement data for: 5999-01-029-9111
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Two or more diode semiconductor devices designed to function as a unit in changing alternating current to direct current. The diode devices are internally connected in series, and are permanently cased, encapsulated, potted, or molded together to form an inseparable unit. These units may be designed as either half-wave or full-wave rectifiers and may be mounted to form either single phase or three phase bridges. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items fabricated in the form of a monolithic or thin film structure that perform the function of a circuit, see integrated circuit (as modified). Excludes:semiconductor devices, unitized; semiconductor device assembly; and rectifier network, unitized.
mil-c-81021 mil spec single material response material document and classification, copper alloy material, oxide surface treatment, 0.375 inches nominal overall height, 0.720 inches nominal overall diameter
Product Characteristics
Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.
- Overall Height
- 0.375 inches nominal
- Overall Diameter
- 0.720 inches nominal
- Material
- copper alloy
- Material Document And Classification
- mil-c-81021 mil spec single material response
- Surface Treatment
- oxide
- Surface Treatment Document And Classification
- mil-f-495 mil spec single treatment response
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| Part Number | Name |
|---|---|
| 1205-0006 | Electrical-Electronic Heat Sink |
| 2-41050 | Electrical-Electronic Heat Sink |
| C4015-205-7 | Electrical-Electronic Heat Sink |
| NF 207 CB | Electrical-Electronic Heat Sink |
FAQs
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When the NSN 5999-01-029-9111 was assigned to the Federal Catalog?
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