5962-01-452-3466
Find complete technical information, availability, and procurement data for: 5962-01-452-3466
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A preformed item of various shapes, and contours, which may have a sandwich or honeycomb core bonded to a metallic or nonmetallic facing material. It is used to enclose integral portions of the fuselage or to form partitions or sections within a wing, empennage, fuselage, nacelle or crew compartment. It may have mounting provisions such as predrilled holes to facilitate installation, but will have no items attached to it except bracket (s) or other securing devices to accommodate its own mounting or support. It may be mounted by means of fasteners, bonding or welding. Excludes:panel, interior lining, aircraft; cover access; cover, access, aircraft; floor (1), aircraft; core material, cellular, structural.
leaded chip carrier inclosure configuration, programmed features provided, 4.5 volts minimum total supply and 5.5 volts maximum total supply voltage rating and type per characteristic, -55.0 to 125.0 celsius operating temp range, pal memory device type
Product Characteristics
Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.
- Operating Temp Range
- -55.0 to 125.0 celsius
- Features Provided
- programmed
- Inclosure Configuration
- leaded chip carrier
- Voltage Rating And Type Per Characteristic
- 4.5 volts minimum total supply and 5.5 volts maximum total supply
- Memory Device Type
- pal
- Terminal Type And Quantity
- 84 flat leads
Related Parts
This NSN group includes multiple components designed to meet specific performance and operational standards. Each listing provides detailed specs, functionality data, and replacement compatibility information:
| Part Number | Name |
|---|---|
| 20605987G4 | Memory Microcircuit |
| 20605988P4 | Memory Microcircuit |
FAQs
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Does NSN 5962-01-452-3466 contain precious materials?
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When the NSN 5962-01-452-3466 was assigned to the Federal Catalog?
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