3130-01-098-8176

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes:devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes:network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

stl ams 6323,heat treat eps 253 rockwell c scale 44 min,48 max hardness,black oxide surface treat ams 2485,inspection eis 1000 magnetic,1.765 in. qd,1.7645 in. id,0.910 in. w oa,3 holes0.188 in. dia located within 0.010 in.of true position,left od corner chamfer 0.044 in. by 45 deg angle,right id corner chamfer 0.020 in. by 45 deg angle general characteristics item description